Printed Electronics
Precision Plasma Surface Treatment for Printed Electronics & Flexible Devices
Advanced plasma surface treatment enables reliable adhesion enhancement on sensitive substrates used in:
- Flexible Printed Circuits (FPCs)- Activating polyimide (PI) and PET films for conductive ink bonding
- OLED/LCD Displays - Pre-lamination treatment of ultra-thin glass (UTFG) and ITO coatings
- Thin-Film Batteries - Surface functionalization of Li-ion electrode foils
|
Challenge |
Plasma Solution |
Technical Benefit |
|
Low surface energy polymers |
Oxygen/Argon/plasma introduces hydroxyl (-OH) & carboxyl (-COOH) groups |
Contact angle reduction from 80°→30° in <1s |
|
Discharge-sensitive materials |
Pulsed DBD plasma at <50°C prevents thermal damage |
Nanoscale modification (<10nm depth) only |
|
Adhesion failure on UTFG |
DCSBD plasma removes hydrocarbons while adding oxygen functionalities |
10⁵× resistivity reduction in rGO circuits |
Material-Specific Protocols
- Polyimide Films (Kapton®)
Process: N₂/H₂ plasma at 20kHz, 7kV
Result: 60% higher ink adhesion vs. corona treatment
- Ultra-Thin Glass (UTFG)
Process: Diffuse Coplanar Surface Barrier Discharge (DCSBD)
Result: 40% conductivity increase in PEDOT:PSS coatings
- Li-ion Electrode Foils
Process: Atmospheric plasma with He/O₂ mix
Result: 15% higher peel strength in laminated cells
- Engineer-Ready Solutions for Discharge-Sensitive Materials
Our systems integrate real-time impedance monitoring and adaptive power control to prevent arcing on:
Temperature-sensitive bio-polymers (e.g., PLGA scaffolds)
Micro-patterned ITO surfaces
Porous battery separators
- Contact Our Surface Engineering Team For:
▶︎ Material compatibility testing report (incl. WCA/SEM/XPS data)
▶︎ Process validation with your substrates (PI/COP/PEN)
▶︎ On-site parameter optimization to prevent discharge damage